In multilayer circuit boards, laser-drilled microvias serve to contact between the individual layers. Faults in the production or filling of microvias can lead to failure of the final product. Contactless inspection with a µsurf circuit board captures the via geometry (diameter, depth). µsurf technology offers the user a measurement system with which small microvias can also be captured without problems.

In SMD assembly, fine pitch solder past printing determines the quality and durability of the modules after mounting. µscan-technology enables the volume and position of the solder paste to be measured as well as the warpage of the circuit board.

Depending on the base material, conductor tracks are applied by etching in the circuit board production. The substrate material and the conductor tracks have to be measured prior to continuing the mounting process. The µscan can be used to capture the substratewarpage , as well as conductor tracks geometry - all in a single measurement process. The roughness on circuit boards and conductor tracks can also be inspected independent of the material in production-related quality assurance. The evaluation of results with the µsoft automation software is adapted by NanoFocus as required by the customer.

When mounting chips in gigahertz modules, minute quantities of adhesive dots are required to fix to the substrate. The precise adherence to the adhesive volume is of critical importance. The contactless µscan profilometer captures the applied adhesive dots with high precision. The associated software calculates the volume from the 3D data.

The lead frames used in IC packaging have to satisfy stringent requirements. All the individual contacts have to lie on a single plane, i.e. they have to be coplanar, and have a defined surface roughness. The component must also show no warpage. The surface and the base area of the lead frame are captured quickly and precisely using the profilometer. Parameters such as coplanarity, separation of contacts, deflection of the base board and roughness are transferred to an analysis protocol.

The assessment of printed circuits should be conducted as early as possible in the production process. Optical measurement systems allow the freshly printed paste to be inspected even prior to the baking process. NanoFocus offers the µscan laser profilometer combined with special automation and evaluation software for this purpose. This calculates height and width. All data are written to a process control card.